Browse NSN 5961-00-838-1700 Listing of Semiconductor Devic
It is our pleasure to inform you that part number 341M, 479-0007-001, 8746940-01, 8746940 01 listed under NSN 5961-00-838-1700 is now available and ready to ship from Fulfillment By ASAP. This part described as a Semiconductor Devic manufactured by Telcom Semiconductor Inc, Boeing Company The, Ogden Air Logistics Center, Dpa Labs Inc. If you’d like a quick quote for NSN 5961-00-838-1700, please fill out the form from below. Are you looking to have it delivered today or tomorrow? We can help! Simply complete the Request For Quote (RFQ) form given below to get started, and we will get back to you within 15 minutes!
Alternative NSN: 5961-00-838-1700 |
Item Name: Semiconductor Devic |
Federal Supply Class (FSC): 5961 Semiconductor Devices and Associated Hardware |
NIIN: 008381700 |
NCB Code: USA (00) |
Manufacturers: Boeing Company The , Dpa Labs Inc , Ogden Air Logistics Center , Telcom Semiconductor Inc |
Part No | Manufacturer | Item Name | QTY | RFQ |
---|---|---|---|---|
341M | telcom semiconductor inc | semiconductor devic | Avl | RFQ |
479-0007-001 | boeing company the | semiconductor devic | Avl | RFQ |
8746940-01 | ogden air logistics center | semiconductor devic | Avl | RFQ |
8746940 01 | dpa labs inc | semiconductor devic | Avl | RFQ |
Characteristics Data of NSN 5961008381700
MRC | Criteria | Characteristic |
---|---|---|
DIODE | CTMZ | SEMICONDUCTOR MATERIALSILICON |
DIODE | CBBL | FEATURES PROVIDEDHERMETICALLY SEALED CASE |
DIODE | TTQY | TERMINAL TYPE AND QUANTITY2 UNINSULATED WIRE LEAD |
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