Browse NSN 5961-00-052-2730 Listing of Semiconductor Devic
It is our pleasure to inform you that part number 1N4135, 1N4135, 1N4135, 1N4135, 1N4135 listed under NSN 5961-00-052-2730 is now available and ready to ship from Fulfillment By ASAP. This part described as a Semiconductor Devic manufactured by Semiconductor Devices Inc, On Semiconductor Corporation, Microsemi Corp, International Diode Corp, Freescale Semiconductor Inc. If you’d like a quick quote for NSN 5961-00-052-2730, please fill out the form from below. Are you looking to have it delivered today or tomorrow? We can help! Simply complete the Request For Quote (RFQ) form given below to get started, and we will get back to you within 15 minutes!
| Alternative NSN: 5961-00-052-2730 |
| Item Name: Semiconductor Devic |
| Federal Supply Class (FSC): 5961 Semiconductor Devices and Associated Hardware |
| NIIN: 000522730 |
| NCB Code: USA (00) |
| Manufacturers: Electronic Industries Inc , Freescale Semiconductor Inc , Gilbert Engineering Co Inc , International Diode Corp , Microsemi Corp , N A P Smd Technology Inc , On Semiconductor Corporation , Semiconductor Devices Inc , Telcom Semiconductor Inc |
| Part No | Manufacturer | Item Name | QTY | RFQ |
|---|---|---|---|---|
| 1N4135 | semiconductor devices inc | semiconductor devic | Avl | RFQ |
| 1N4135 | on semiconductor corporation | semiconductor devic | Avl | RFQ |
| 1N4135 | microsemi corp | semiconductor devic | Avl | RFQ |
| 1N4135 | international diode corp | semiconductor devic | Avl | RFQ |
| 1N4135 | freescale semiconductor inc | semiconductor devic | Avl | RFQ |
| 1N4135 | electronic industries inc | semiconductor devic | Avl | RFQ |
| 1N4135 | telcom semiconductor inc | semiconductor devic | Avl | RFQ |
| 1N4135 | n a p smd technology inc | semiconductor devic | Avl | RFQ |
| 1N4135 | gilbert engineering co inc | semiconductor devic | Avl | RFQ |
| RELEASE4376 | electronic industries inc | semiconductor devic | Avl | RFQ |
Characteristics Data of NSN 5961000522730
| MRC | Criteria | Characteristic |
|---|---|---|
| ABBH | INCLOSURE MATERIAL | GLASS |
| ABHP | OVERALL LENGTH | 0.230 INCHES MINIMUM AND 0.300 INCHES MAXIMUM |
| ABJT | TERMINAL LENGTH | 1.000 INCHES MINIMUM |
| ADAV | OVERALL DIAMETER | 0.085 INCHES MINIMUM AND 0.107 INCHES MAXIMUM |
| ALAZ | JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION | DO-7 |
| AXGY | MOUNTING METHOD | TERMINAL |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| CTMZ | SEMICONDUCTOR MATERIAL | SILICON |
| CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 100.0 MAXIMUM NOMINAL REGULATOR VOLTAGE |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 0.25 MILLIAMPERES MAXIMUM MAXIMUM REVERSE SURGE CURRENT |
| CTRD | POWER RATING PER CHARACTERISTIC | 250.0 MILLIWATTS MAXIMUM TOTAL POWER DISSIPATION |
| CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 200.0 DEG CELSIUS JUNCTION |
| TTQY | TERMINAL TYPE AND QUANTITY | 2 UNINSULATED WIRE LEAD |
| ZZZK | SPECIFICATION/STANDARD DATA | 80131-RELEASE4376 PROFESSIONAL/INDUSTRIAL ASSOCIATION SPECIFICATION |
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