Browse NSN 5961-00-057-4801 Listing of Semiconductor Devic
It is our pleasure to inform you that part number 472-0263-001, 958-474-305, A1081, A1081, SW1002 listed under NSN 5961-00-057-4801 is now available and ready to ship from Fulfillment By ASAP. This part described as a Semiconductor Devic manufactured by Boeing Company The, Teledyne Technologies Incorporated, Micro Uspd Inc, Gilbert Engineering Co Inc. If you’d like a quick quote for NSN 5961-00-057-4801, please fill out the form from below. Are you looking to have it delivered today or tomorrow? We can help! Simply complete the Request For Quote (RFQ) form given below to get started, and we will get back to you within 15 minutes!
| Alternative NSN: 5961-00-057-4801 |
| Item Name: Semiconductor Devic |
| Federal Supply Class (FSC): 5961 Semiconductor Devices and Associated Hardware |
| NIIN: 000574801 |
| NCB Code: USA (00) |
| Manufacturers: Boeing Company The , Gilbert Engineering Co Inc , Micro Uspd Inc , Teledyne Technologies Incorporated |
| Part No | Manufacturer | Item Name | QTY | RFQ |
|---|---|---|---|---|
| 472-0263-001 | boeing company the | semiconductor devic | Avl | RFQ |
| 958-474-305 | boeing company the | semiconductor devic | Avl | RFQ |
| A1081 | teledyne technologies incorporated | semiconductor devic | Avl | RFQ |
| A1081 | micro uspd inc | semiconductor devic | Avl | RFQ |
| SW1002 | gilbert engineering co inc | semiconductor devic | Avl | RFQ |
Characteristics Data of NSN 5961000574801
| MRC | Criteria | Characteristic |
|---|---|---|
| ABBH | INCLOSURE MATERIAL | METAL |
| ABHP | OVERALL LENGTH | 0.260 INCHES MAXIMUM |
| ABJT | TERMINAL LENGTH | 0.500 INCHES MINIMUM |
| ADAV | OVERALL DIAMETER | 0.370 INCHES MAXIMUM |
| ALAS | INTERNAL CONFIGURATION | JUNCTION CONTACT |
| ALAZ | JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION | TO-9 |
| ALBA | ELECTRODE INTERNALLY-ELECTRICALLY CONNECTED TO CASE | ANODE |
| AXGY | MOUNTING METHOD | TERMINAL |
| AYQS | TERMINAL CIRCLE DIAMETER | 0.200 INCHES NOMINAL |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| CTMZ | III SEMICONDUCTOR MATERIAL | SILICON |
| CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 160.0 MAXIMUM BREAKDOWN VOLTAGE, COLLECTOR-TO-BASE, EMITTER OPEN AND 4.0 MAXIMUM EMITTER TO BASE VOLTAGE, STATIC, COLLECTOR OPEN AND 140.0 MAXIMUM BREAKDOWN VOLTAGE, COLLECTOR-TO-EMITTER, BASE OPEN |
| CTRK | TRANSFER RATIO | 30.0 MINIMUM STATIC FORWARD CURRENT TRANSFER RATIO, COMMON-EMITTER AND 120.0 MAXIMUM STATIC FORWARD CURRENT TRANSFER RATIO, COMMON-EMITTER |
| FEAT | SPECIAL FEATURES | JUNCTION PATTERN ARRANGEMENT: NPN |
| TTQY | TERMINAL TYPE AND QUANTITY | 3 UNINSULATED WIRE LEAD |
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