Browse NSN 5962-01-032-6839 Listing of Microcircuit Memory
It is our pleasure to inform you that part number 34772-1, 34772-1, 34772-1, HMI-7621-8, M38510 20402BEB listed under NSN 5962-01-032-6839 is now available and ready to ship from Fulfillment By ASAP. This part described as a Microcircuit Memory manufactured by Philips Semiconductors Ltd, Intersil Inc, Rockwell Collins Inc. If you’d like a quick quote for NSN 5962-01-032-6839, please fill out the form from below. Are you looking to have it delivered today or tomorrow? We can help! Simply complete the Request For Quote (RFQ) form given below to get started, and we will get back to you within 15 minutes!
| Alternative NSN: 5962-01-032-6839 |
| Item Name: Microcircuit Memory |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 010326839 |
| NCB Code: USA (01) |
| Manufacturers: Intersil Inc , Philips Semiconductors Ltd , Rockwell Collins Inc |
| Part No | Manufacturer | Item Name | QTY | RFQ |
|---|---|---|---|---|
| 34772-1 | philips semiconductors ltd | microcircuit memory | Avl | RFQ |
| 34772-1 | intersil inc | microcircuit memory | Avl | RFQ |
| 34772-1 | rockwell collins inc | microcircuit memory | Avl | RFQ |
| HMI-7621-8 | intersil inc | microcircuit memory | Avl | RFQ |
| M38510 20402BEB | intersil inc | microcircuit memory | Avl | RFQ |
| M38510 20402BEB | philips semiconductors ltd | microcircuit memory | Avl | RFQ |
Characteristics Data of NSN 5962010326839
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.840 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.140 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 794.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | SCHOTTKY AND HERMETICALLY SEALED AND 3-STATE OUTPUT AND HIGH IMPEDANCE AND PROGRAMMABLE AND BIPOLAR |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 10 INPUT |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-2 MIL-M-38510 |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 85.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 85.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | ROM |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |
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