Browse NSN 5962-01-048-2015 Listing of Microcircuit Memory
It is our pleasure to inform you that part number 515C9506-02, 515C9506-02-020, 515C9506-02-020, AM9702AHDL B, B1702A listed under NSN 5962-01-048-2015 is now available and ready to ship from Fulfillment By ASAP. This part described as a Microcircuit Memory manufactured by Ge Aviation Systems Llc, Intel Corporation, Advanced Micro Devices Inc, Dla Land And Maritime. If you’d like a quick quote for NSN 5962-01-048-2015, please fill out the form from below. Are you looking to have it delivered today or tomorrow? We can help! Simply complete the Request For Quote (RFQ) form given below to get started, and we will get back to you within 15 minutes!
| Alternative NSN: 5962-01-048-2015 |
| Item Name: Microcircuit Memory |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 010482015 |
| NCB Code: USA (01) |
| Manufacturers: Advanced Micro Devices Inc , Dla Land And Maritime , Ge Aviation Systems Llc , Intel Corporation |
| Part No | Manufacturer | Item Name | QTY | RFQ |
|---|---|---|---|---|
| 515C9506-02 | ge aviation systems llc | microcircuit memory | Avl | RFQ |
| 515C9506-02-020 | intel corporation | microcircuit memory | Avl | RFQ |
| 515C9506-02-020 | ge aviation systems llc | microcircuit memory | Avl | RFQ |
| AM9702AHDL B | advanced micro devices inc | microcircuit memory | Avl | RFQ |
| B1702A | intel corporation | microcircuit memory | Avl | RFQ |
| DMS 84124B | dla land and maritime | microcircuit memory | Avl | RFQ |
Characteristics Data of NSN 5962010482015
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 1.230 INCHES MINIMUM AND 1.285 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.510 INCHES MINIMUM AND 0.545 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.150 INCHES MINIMUM AND 0.225 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 2.0 WATTS |
| AFGA | OPERATING TEMP RANGE | -40.0/+70.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+125.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND PROGRAMMABLE AND W/BUFFERED OUTPUT AND POSITIVE OUTPUTS AND BURN IN |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | P-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 10 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -20.0 VOLTS MINIMUM POWER SOURCE AND 0.5 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 900.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 900.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | ROM |
| CZZZ | MEMORY CAPACITY | UNKNOWN |
| TEST | TEST DATA DOCUMENT | 86360-515C9506-02 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING |
| TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
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