Browse NSN 5962-01-130-3723 Listing of Microcircuit Memory
It is our pleasure to inform you that part number 14410801 25, 14410801 25, 85694600 03, 85694600 03, 93448 listed under NSN 5962-01-130-3723 is now available and ready to ship from Fulfillment By ASAP. This part described as a Microcircuit Memory manufactured by General Dynamics Corp, General Dynamics Information Systems, Fairchild Semiconductor Corp, Dla Land And Maritime. If you’d like a quick quote for NSN 5962-01-130-3723, please fill out the form from below. Are you looking to have it delivered today or tomorrow? We can help! Simply complete the Request For Quote (RFQ) form given below to get started, and we will get back to you within 15 minutes!
| Alternative NSN: 5962-01-130-3723 |
| Item Name: Microcircuit Memory |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 011303723 |
| NCB Code: USA (01) |
| Manufacturers: Dla Land And Maritime , Fairchild Semiconductor Corp , General Dynamics Corp , General Dynamics Information Systems |
| Part No | Manufacturer | Item Name | QTY | RFQ |
|---|---|---|---|---|
| 14410801 25 | general dynamics corp | microcircuit memory | Avl | RFQ |
| 14410801 25 | general dynamics information systems | microcircuit memory | Avl | RFQ |
| 85694600 03 | general dynamics information systems | microcircuit memory | Avl | RFQ |
| 85694600 03 | general dynamics corp | microcircuit memory | Avl | RFQ |
| 93448 | fairchild semiconductor corp | microcircuit memory | Avl | RFQ |
| ROM PROM FAMILY 026 | dla land and maritime | microcircuit memory | Avl | RFQ |
Characteristics Data of NSN 5962011303723
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 1.290 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.150 INCHES MINIMUM AND 0.210 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| AGAV | END ITEM IDENTIFICATION | MOD KIT A/F 36378 |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND BIPOLAR AND PROGRAMMABLE AND 3-STATE OUTPUT |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 13 INPUT |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-3 MIL-M-38510 |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -1.2 VOLTS MINIMUM POWER SOURCE AND 5.5 VOLTS MAXIMUM POWER SOURCE |
| CZER | MEMORY DEVICE TYPE | ROM |
| CZZZ | MEMORY CAPACITY | UNKNOWN |
| TEST | TEST DATA DOCUMENT | 27963-14410801 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRA |
| TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
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