Browse NSN 5962-01-353-3061 Listing of Microcircuit Memory
It is our pleasure to inform you that part number 5962-38294, 5962-3829410MYA, 5962-3829410MYB, 5962 3829410MYX, 5962-8552509YA listed under NSN 5962-01-353-3061 is now available and ready to ship from Fulfillment By ASAP. This part described as a Microcircuit Memory manufactured by Dla Land And Maritime, Integrated Device Technology Inc, Intel Corporation, Micron Technology Inc. If you’d like a quick quote for NSN 5962-01-353-3061, please fill out the form from below. Are you looking to have it delivered today or tomorrow? We can help! Simply complete the Request For Quote (RFQ) form given below to get started, and we will get back to you within 15 minutes!
Alternative NSN: 5962-01-353-3061 |
Item Name: Microcircuit Memory |
Federal Supply Class (FSC): 5962 Microcircuits Electronic |
NIIN: 013533061 |
NCB Code: USA (01) |
Manufacturers: Dla Land And Maritime , Integrated Device Technology Inc , Intel Corporation , Micron Technology Inc |
Part No | Manufacturer | Item Name | QTY | RFQ |
---|---|---|---|---|
5962-38294 | dla land and maritime | microcircuit memory | Avl | RFQ |
5962-3829410MYA | dla land and maritime | microcircuit memory | Avl | RFQ |
5962-3829410MYB | dla land and maritime | microcircuit memory | Avl | RFQ |
5962 3829410MYX | dla land and maritime | microcircuit memory | Avl | RFQ |
5962-8552509YA | dla land and maritime | microcircuit memory | Avl | RFQ |
5962-8552509YB | dla land and maritime | microcircuit memory | Avl | RFQ |
5962-8552509YX | dla land and maritime | microcircuit memory | Avl | RFQ |
IDT7164L45L32B | integrated device technology inc | microcircuit memory | Avl | RFQ |
MR5164L 45 B | intel corporation | microcircuit memory | Avl | RFQ |
MT5C6408ECW-45L | micron technology inc | microcircuit memory | Avl | RFQ |
Characteristics Data of NSN 5962013533061
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 0.560 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.442 INCHES MINIMUM AND 0.458 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.060 INCHES MINIMUM AND 0.120 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
AGAV | END ITEM IDENTIFICATION | COUNTERMEASURES SET AN/ALQ-135 |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 25 INPUT |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
CZEQ | TIME RATING PER CHACTERISTIC | 45.00 NANOSECONDS MAXIMUM DELAY |
CZER | MEMORY DEVICE TYPE | RAM |
CTQX | CURRENT RATING PER CHARACTERISTIC | 105.00 MILLIAMPERES MAXIMUM SUPPLY |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
TTQY | TERMINAL TYPE AND QUANTITY | 32 LEADLESS |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | C-12 MIL-M-38510 |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND STATIC OPERATION |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
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