Part Number BCM 23C64D 8168 with NSN 5962-01-260-3008 by Allegro Microsystems Inc - Get an Instant Quote
Part Number: BCM 23C64D 8168
Alternate P/N: BCM23C64D8168
Manufacturer: Allegro Microsystems Inc
NSN: 5962-01-260-3008 (5962012603008)
NIIN: 012603008
Item Name : Microcircuit Memory
CAGE Code: 31019
We’re happy to announce that part number BCM 23C64D 8168 with NSN 5962012603008 is available and in stock. Part number BCM 23C64D 8168 as Microcircuit Memory manufactured by Allegro Microsystems Inc having CAGE Code 31019. This part falls under FSC 5962 Microcircuits Electronic and NIIN of BCM 23C64D 8168 is 012603008 .
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Fulfillment by ASAP, owned and operated by ASAP Semiconductor, is an industry-leading supplier of BCM 23C64D 8168 by Allegro Microsystems Inc parts and components for the aerospace, aviation, and defense industries. With more than 2 billion parts, new and obsolete, sourced from over 5000 manufacturers, we can fulfill any of our customers’ procurement needs. And, with our many advanced shipping facilities across the continental United States, we can deliver them at the fastest shipping times and turnaround times in the industry. Get BCM 23C64D 8168 now!
The National Stock Number or NATO Stock Number (NSN) is a 13-digit serial number assigned by the Defense Logistics Agency to all items that are procured, stocked, and issued through the federal supply system. For more information on BCM 23C64D 8168, NSN 5962012603008 or other NSNs, feel free to call us at our toll-free number, +1-714-705-4780, or email us at sales@fulfillmentbyasap.com.
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Characteristics Data of NSN 5962-01-260-3008, 5962012603008
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 1.290 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.595 INCHES NOMINAL |
| ADAU | BODY HEIGHT | 0.165 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+125.0 DEG CELSIUS |
| AGAV | END ITEM IDENTIFICATION | 5895-01-146-6736 DIGITAL COMMUNI |
| CBBL | FEATURES PROVIDED | ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND 3-STATE OUTPUT |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 14 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 325.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 325.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | ROM |
| CZZZ | MEMORY CAPACITY | UNKNOWN |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
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