Part Number IDT6116LA150TDB with NSN 5962-01-267-7974 by Integrated Device Technology Inc - Get an Instant Quote
Part Number: IDT6116LA150TDB
Manufacturer: Integrated Device Technology Inc
NSN: 5962-01-267-7974 (5962012677974)
NIIN: 012677974
Item Name : Microcircuit Memory
CAGE Code: 61772
We’re happy to announce that part number IDT6116LA150TDB with NSN 5962012677974 is available and in stock. Part number IDT6116LA150TDB as Microcircuit Memory manufactured by Integrated Device Technology Inc having CAGE Code 61772. This part falls under FSC 5962 Microcircuits Electronic and NIIN of IDT6116LA150TDB is 012677974 .
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Fulfillment by ASAP, owned and operated by ASAP Semiconductor, is an industry-leading supplier of IDT6116LA150TDB by Integrated Device Technology Inc parts and components for the aerospace, aviation, and defense industries. With more than 2 billion parts, new and obsolete, sourced from over 5000 manufacturers, we can fulfill any of our customers’ procurement needs. And, with our many advanced shipping facilities across the continental United States, we can deliver them at the fastest shipping times and turnaround times in the industry. Get IDT6116LA150TDB now!
The National Stock Number or NATO Stock Number (NSN) is a 13-digit serial number assigned by the Defense Logistics Agency to all items that are procured, stocked, and issued through the federal supply system. For more information on IDT6116LA150TDB, NSN 5962012677974 or other NSNs, feel free to call us at our toll-free number, +1-714-705-4780, or email us at sales@fulfillmentbyasap.com.
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NSN Information for Part Number IDT6116LA150TDB with NSN 5962-01-267-7974, 5962012677974
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-267-7974 Item Description: Microcircuit Memory | 5962 | 012677974 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| 7 | B | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| Idt6116la150tdb | 5 | 2 | 5 |
Characteristics Data of NSN 5962-01-267-7974, 5962012677974
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 1.280 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.310 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.185 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND HIGH SPEED AND BIDIRECTIONAL |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 22 INPUT |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-9 MIL-M-38510 |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZER | MEMORY DEVICE TYPE | RAM |
| CZZZ | MEMORY CAPACITY | UNKNOWN |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
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