Part Number MKB6116J-83 with NSN 5962-01-192-0210 by Stmicroelectronics Inc - Get an Instant Quote
Part Number: MKB6116J-83
Alternate P/N: MKB6116J83
Manufacturer: Stmicroelectronics Inc
NSN: 5962-01-192-0210 (5962011920210)
NIIN: 011920210
Item Name : Microcircuit Memory
CAGE Code: 50088
We’re happy to announce that part number MKB6116J-83 with NSN 5962011920210 is available and in stock. Part number MKB6116J-83 as Microcircuit Memory manufactured by Stmicroelectronics Inc having CAGE Code 50088. This part falls under FSC 5962 Microcircuits Electronic and NIIN of MKB6116J-83 is 011920210 .
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Fulfillment by ASAP, owned and operated by ASAP Semiconductor, is an industry-leading supplier of MKB6116J-83 by Stmicroelectronics Inc parts and components for the aerospace, aviation, and defense industries. With more than 2 billion parts, new and obsolete, sourced from over 5000 manufacturers, we can fulfill any of our customers’ procurement needs. And, with our many advanced shipping facilities across the continental United States, we can deliver them at the fastest shipping times and turnaround times in the industry. Get MKB6116J-83 now!
The National Stock Number or NATO Stock Number (NSN) is a 13-digit serial number assigned by the Defense Logistics Agency to all items that are procured, stocked, and issued through the federal supply system. For more information on MKB6116J-83, NSN 5962011920210 or other NSNs, feel free to call us at our toll-free number, +1-714-705-4780, or email us at sales@fulfillmentbyasap.com.
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NSN Information for Part Number MKB6116J-83 with NSN 5962-01-192-0210, 5962011920210
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-192-0210 Item Description: Microcircuit Memory | 5962 | 011920210 | 0 | N | B | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | B | A | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
Mkb6116j-83 | 3 | 2 | 5 |
Characteristics Data of NSN 5962-01-192-0210, 5962011920210
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 31.75 MILLIMETERS NOMINAL |
ADAT | BODY WIDTH | 14.66 MILLIMETERS NOMINAL |
ADAU | BODY HEIGHT | 5.51 MILLIMETERS MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
AFGA | OPERATING TEMP RANGE | +0.0/+70.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND HIGH SPEED AND LOW POWER AND W/ENABLE |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 22 INPUT |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
CZEQ | TIME RATING PER CHACTERISTIC | 200.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 200.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
CZER | MEMORY DEVICE TYPE | ROM |
TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
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