Browse NSN 5961-00-914-3087 Listing of Semiconductor Devic
It is our pleasure to inform you that part number 10939-182, 1902-0025, 1902-0025, CD35706, DZ730820N listed under NSN 5961-00-914-3087 is now available and ready to ship from Fulfillment By ASAP. This part described as a Semiconductor Devic manufactured by Freescale Semiconductor Inc, Hewlett Packard Co, Avago Technologies U S Inc, Telcom Semiconductor Inc, Microsemi Corp. If you’d like a quick quote for NSN 5961-00-914-3087, please fill out the form from below. Are you looking to have it delivered today or tomorrow? We can help! Simply complete the Request For Quote (RFQ) form given below to get started, and we will get back to you within 15 minutes!
Alternative NSN: 5961-00-914-3087 |
Item Name: Semiconductor Devic |
Federal Supply Class (FSC): 5961 Semiconductor Devices and Associated Hardware |
NIIN: 009143087 |
NCB Code: USA (00) |
Manufacturers: American Shizuki Corporation , Avago Technologies U S Inc , Fairchild Semiconductor Corp , Freescale Semiconductor Inc , Hewlett Packard Co , Microsemi Corp , On Semiconductor Corporation , Telcom Semiconductor Inc |
Part No | Manufacturer | Item Name | QTY | RFQ |
---|---|---|---|---|
10939-182 | freescale semiconductor inc | semiconductor devic | Avl | RFQ |
1902-0025 | hewlett packard co | semiconductor devic | Avl | RFQ |
1902-0025 | avago technologies u s inc | semiconductor devic | Avl | RFQ |
CD35706 | telcom semiconductor inc | semiconductor devic | Avl | RFQ |
DZ730820N | microsemi corp | semiconductor devic | Avl | RFQ |
FZ7260 | fairchild semiconductor corp | semiconductor devic | Avl | RFQ |
PS18260A | american shizuki corporation | semiconductor devic | Avl | RFQ |
SZ10939 182 | freescale semiconductor inc | semiconductor devic | Avl | RFQ |
SZ10939-182 | on semiconductor corporation | semiconductor devic | Avl | RFQ |
SZ30016-182 | freescale semiconductor inc | semiconductor devic | Avl | RFQ |
Characteristics Data of NSN 5961009143087
MRC | Criteria | Characteristic |
---|---|---|
AXGY | MOUNTING METHOD | TERMINAL |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED CASE |
CTMZ | SEMICONDUCTOR MATERIAL | SILICON |
TTQY | TERMINAL TYPE AND QUANTITY | 2 UNINSULATED WIRE LEAD |
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