Browse NSN 5961-01-341-3322 Listing of Semiconductor Devic
It is our pleasure to inform you that part number 0122-0109, 0122-0109 listed under NSN 5961-01-341-3322 is now available and ready to ship from Fulfillment By ASAP. This part described as a Semiconductor Devic manufactured by Hewlett Packard Co, Avago Technologies U S Inc. If you’d like a quick quote for NSN 5961-01-341-3322, please fill out the form from below. Are you looking to have it delivered today or tomorrow? We can help! Simply complete the Request For Quote (RFQ) form given below to get started, and we will get back to you within 15 minutes!
Alternative NSN: 5961-01-341-3322 |
Item Name: Semiconductor Devic |
Federal Supply Class (FSC): 5961 Semiconductor Devices and Associated Hardware |
NIIN: 013413322 |
NCB Code: USA (01) |
Manufacturers: Avago Technologies U S Inc , Hewlett Packard Co |
Part No | Manufacturer | Item Name | QTY | RFQ |
---|---|---|---|---|
0122-0109 | hewlett packard co | semiconductor devic | Avl | RFQ |
0122-0109 | avago technologies u s inc | semiconductor devic | Avl | RFQ |
Characteristics Data of NSN 5961013413322
MRC | Criteria | Characteristic |
---|---|---|
ABBH | INCLOSURE MATERIAL | CERAMIC |
ABHP | OVERALL LENGTH | 0.156 INCHES NOMINAL |
ABJT | TERMINAL LENGTH | 1.000 INCHES MINIMUM |
ABKW | OVERALL HEIGHT | 0.093 INCHES NOMINAL |
ABMK | OVERALL WIDTH | 0.109 INCHES NOMINAL |
AGAV | END ITEM IDENTIFICATION | 6625-01-225-0087 |
AXGY | MOUNTING METHOD | TERMINAL |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED CASE |
CTMZ | SEMICONDUCTOR MATERIAL | SILICON |
TTQY | TERMINAL TYPE AND QUANTITY | 2 TAB, SOLDER LUG |
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